Tlam\u2122 is a thermally conductive IMPCB substrate used for heat dissipation in electronics circuit boards used in Power Supplies, DC-DC Converters, LEDs & Ballast Lighting, Automotive, Appliances, Commercial & Industrial Motor Drives, and Military & Aerospace Applications.The heart of this system is the thermally conductive pre-preg, Tlam\u2122 PP HTD.\u00a0 This ceramically filled 2.2 W\/mK, dielectric prepreg offers 8 times better thermal performance over FR4, while maintaining good adhesion and voltage breakdown properties. \u00a0Tlam\u2122 PP HTD is a \u201cB\u201d State epoxy film providing room temperature stability for 6 months. \u00a0Tlam\u2122 PP HTD is provided in multiple thicknesses.\u00a0 Thinner films offer better thermal performance while thicker films offer better dielectric strength.Tlam\u2122 PP HTD can be used to build many different combinations of PCB laminates.\u00a0\u00a0 The simplest is copper foil, Tlam\u2122 PP HTD dielectric and an aluminum base plate which acts as a heatsink and adds rigidity. Board complexity goes up from here offering multi-layer boards constructions and PCB structures can further include varying layers of Tlam\u2122 PP HTD and FR4 layers to give the thermal properties where need while maintaining cost effectiveness.Tlam\u2122 PP HTD can laminated with copper foils from \u00bd oz to 4 oz can be used aluminum or copper base plates ranging from 2.5mm to 6mm thick.\u00a0 Further Tlam\u2122 PP HTD and be laminated on both sides with copper films to make traditional type PCB Cores.<\/p>","protected":false},"excerpt":{"rendered":"
– Low Thermal Resistance for SMD & Chip & Wire Components
\n– Compatible with Heavy Copper Foil & most Pre-pregs
\n– Low Modulus for Stress Relief & High Reliability
\n– High Tg for Excellent HV & Hi-Temperature Operation (1HTD)
\n– Mechanically Rugged under Vibration and Mechanical Shock
\n– Integral aluminum Base Plate for Mechanical & Thermal Interface
\n– Compatible with Power Substrate & Multilayer Construction
\n– Uses Standard low-cost PCB Fabrication Techniques
\n– Can run through standard pick and place SMT and manual wire bond processes.<\/p>","protected":false},"featured_media":16955,"template":"","meta":{"_acf_changed":false},"product_brand":[233],"product_cat":[176,198,206],"product_tag":[183],"class_list":["post-18806","product","type-product","status-publish","has-post-thumbnail","product_brand-laird","product_cat-laird","product_cat-laird-thermal-interface-materials","product_cat-tlam-thermally-conductive-pcb-system","product_tag-laird","first","instock","product-type-simple"],"acf":[],"yoast_head":"\n