Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W\/mK, low thermal resistances can be achieved at low pressures. Tflex 300-H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.<\/p>","protected":false},"excerpt":{"rendered":"
– Extreme compliancy allows material to \u201ctotally blanket\u201d component(s)
\n– Low compression set enables the pad to be reused many times<\/p>","protected":false},"featured_media":17285,"template":"","meta":{"_acf_changed":false},"product_brand":[233],"product_cat":[199,176,198],"product_tag":[183],"class_list":["post-18668","product","type-product","status-publish","has-post-thumbnail","product_brand-laird","product_cat-gap-fillers","product_cat-laird","product_cat-laird-thermal-interface-materials","product_tag-laird","first","instock","product-type-simple"],"acf":[],"yoast_head":"\n