Euro Technologies confirms its increasing presence on the European market of the Thermally Conductive Interface Materials with new outstanding products dedicated to mass production. Euro Technologies completes its well-known Gap Fillers portfolio with the new technology of dispensable thermally conductive gels.
These products are thermally conductive particle filled silicone gels with high conformability and thermal conductive properties. They are ideal for applications where large gap tolerances are present and designed to replace conventional thermal conductive gap filler pads.
Euro Technologies dispensable gap fillers are soft and compliant transferring little to no pressure between interfaces. Thanks to a higher viscosity than grease, this new technology of TIM eliminates the bleed and pump-out typically associated with grease. Bond line variances can also be more easily controlled than with traditional thermal pads.
Our dispensable gap fillers can be applied like grease and are easily dispensable from a wide range of commercially available equipment including screen print, syringe and automated equipment.
Our products are one-component pre-cured material and do not require mixing and curing, auto-dispensing process can reduce the assembly time and cost, which make the design more flexible.
Main applications are for example Flip chip microprocessors, PPGAs, micro BGAs, BGAs, DSP chips, graphic accelerator chips, Other high-wattage electronic components and LED lighting.
Euro Technologies offers dispensable gap fillers with different thermal conductivity level starting from 1,8 W/mK to 3,7 W/mK in order to better fit any specific requirement.
Please don’t hesitate to contact Euro Technologies to receive technical data sheets and any further information you may need about this new possibility.
