Liquid Gap Fillers
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Laird’s Liquid Gap Fillers are thermally conductive materials dispensed to fill uneven or complex gaps between hot electronic components and heat sinks. These super-compliant formulations eliminate air pockets and optimize thermal transfer without applying excessive pressure, making them ideal for fragile assemblies and high-density designs.
Optimized for automated, high-volume production, Laird’s dispensable fillers are widely used in telecom, datacom, and automotive systems. Compared to traditional gap pads, liquid fillers provide superior coverage for irregular surfaces and offer consistent thermal performance with efficient, automated application.
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