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Tputty™ 607MF is a high thermally conductive single part dispensable gap filler specially designed to response to today’s need for high-speed assembly. It’s 105g/min flow rate benefit engineers seeking productivity improvement within assembly operations. With 6.2W/mK thermal conductivity and high reliability, Tputty 607MF is ideal for various applications. Tputty™ 607MF is a soft, compliant, high thermal conductivity dispensable gap filler providing the lowest thermal resistance and highest reliability available.
– 6.2W/mK thermal conductivity
– High flow rate and good tackiness
– Easily reworkable
– Demonstrated thermal cycling stability
– Meets ROHS and REACH requirements
| Colour | Blue |
| Shelf Life | 9 months |
| Density | 3.42 g/cc |
| Thermal conductivity | 6.20 W/mK |
| Maximum Operating Temperature | 200°C |
| Minimum Operating Temperature | -40°C |
| ROHS Compliant | Yes |
| REACH | Yes |
The Tputty™ 607MF are available in a range of variants designed to meet specific application needs. These versions differ in format, construction, or additional features, providing flexibility in design and optimal compatibility with various systems and assembly processes.
Interested in learning more about how the Tputty™ 607MF can support your project or application? Whether you need technical details, pricing information, or would like to request a sample, our team is here to help. Fill out the form below and we’ll get back to you with the support and solutions you need. Discover how the Tputty™ 607MF can bring added value to your design and performance requirements.
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Any reliance you place on such information is strictly at your own risk. We disclaim any liability for errors, inaccuracies, or omissions and for any loss, injury, or damages resulting from the use of the information provided.
Technical specifications, data, or figures may be subject to change without notice. For official, detailed, or binding information, please contact us directly.
