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Tflex SF16 is an innovative, high performing thermal material in Laird’s non-silicone gap filler portfolio. The non-silicone technology provides products with excellent deflection properties, providing minimal pressure on components during deflection. Very little pressure is required to reach the lowest possible thermal resistance. Thickness ranges from 0.5mm (0.020″) to 5mm (0.200″) in 0.5mm (0.020″) increments available as standard.
– Non-silicone formulation
– Exceptionally low thermal resistance
– Low peak and residual pressure
– Excellent surface wetting for low contact resistance
– Environmentally friendly solution that meets regulatory requirements including ROHS and REACH
| Colour | Light Tan |
| Shelf Life | 2 years from Date of Shipment |
| Minimum Bondline Thickness | 0.50 mm |
| Density | 3.09 g/cc |
| Thermal conductivity | 16.00 W/mK |
| Maximum Operating Temperature | 125°C |
| Minimum Operating Temperature | -40°C |
| Dielectric constant | 9.00 |
| ROHS Compliant | Yes |
| Lead Free | Yes |
| REACH | Yes |
The Tflex™ SF16 are available in a range of variants designed to meet specific application needs. These versions differ in format, construction, or additional features, providing flexibility in design and optimal compatibility with various systems and assembly processes.
Interested in learning more about how the Tflex™ SF16 can support your project or application? Whether you need technical details, pricing information, or would like to request a sample, our team is here to help. Fill out the form below and we’ll get back to you with the support and solutions you need. Discover how the Tflex™ SF16 can bring added value to your design and performance requirements.
The information and technical data provided on this website are for general informational purposes only. While we strive to ensure that all content is accurate, complete, and up to date, we make no representations or warranties of any kind, express or implied, regarding the reliability, suitability, or availability of the information contained herein.
Any reliance you place on such information is strictly at your own risk. We disclaim any liability for errors, inaccuracies, or omissions and for any loss, injury, or damages resulting from the use of the information provided.
Technical specifications, data, or figures may be subject to change without notice. For official, detailed, or binding information, please contact us directly.
