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Tputty™ SF560

Silicon-free liquid gap filler

Tputty™SF560 is a high-performance single component dispensable gap filler. It is designed to offer a thermal conductivity in the 5-6W range, along with good thermal resistance. Silicone free formulation and softness will best suit automotive applications which require low compressive forces and are sensitive to volatile silicone molecules or silicon oil bleeding.

Features and Benefits

The Tputty™ SF560 offer a combination of functional and performance-oriented characteristics that make them a reliable choice for demanding applications.

– Non-silicone Thermal Conductivity 5.6 W/mK
– Dispensable and Compliant
– Easily reworkable Meets RoHS and REACH requirements
– Very low fogging Elevated temperature resistance

Examples or main applications

The Tputty™ SF560 are well-suited for integration into a wide range of electronic and industrial systems. Their performance and versatility make them a dependable choice across multiple sectors, supporting both high-volume manufacturing and specialized applications where reliability and efficiency are critical.
– Automotive ADAS
– Automotive Lighting
– Automotive Infotainment
– Digital cameras
– Radar

Properties

The Tputty™ SF560 feature a balanced combination of physical, thermal, and electrical properties, making them suitable for a broad range of technical applications. Each characteristic is validated through industry-recognized test methods to ensure consistency, performance, and compliance with quality standards.

Colourgrey
Shelf Life6 months
Minimum Bondline Thickness0.15 microns (0.15 mm)
Density3.40 g/cc
Maximum Operating Temperature150°C
Minimum Operating Temperature-40°C
UL Flamming RatingV0
Outgassing TML0.30%
Outgassing CVCM0.10%
ROHS CompliantYes
REACHYes

Product variants

The Tputty™ SF560 are available in a range of variants designed to meet specific application needs. These versions differ in format, construction, or additional features, providing flexibility in design and optimal compatibility with various systems and assembly processes.

Capabilities & customisation

Automated Pad PlacementAutomated PackagingCustom AutomationCustom Product DevelopmentModelingPrototypingServiceTesting

Industries

Automotive and Industrial ElectronicsAutonomous VehicleIndustrial Electronics

General Catalogue

Request information

Interested in learning more about how the Tputty™ SF560 can support your project or application? Whether you need technical details, pricing information, or would like to request a sample, our team is here to help. Fill out the form below and we’ll get back to you with the support and solutions you need. Discover how the Tputty™ SF560 can bring added value to your design and performance requirements.

Related products

The information and technical data provided on this website are for general informational purposes only. While we strive to ensure that all content is accurate, complete, and up to date, we make no representations or warranties of any kind, express or implied, regarding the reliability, suitability, or availability of the information contained herein.

Any reliance you place on such information is strictly at your own risk. We disclaim any liability for errors, inaccuracies, or omissions and for any loss, injury, or damages resulting from the use of the information provided.

Technical specifications, data, or figures may be subject to change without notice. For official, detailed, or binding information, please contact us directly.