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Tputty™SF560 is a high-performance single component dispensable gap filler. It is designed to offer a thermal conductivity in the 5-6W range, along with good thermal resistance. Silicone free formulation and softness will best suit automotive applications which require low compressive forces and are sensitive to volatile silicone molecules or silicon oil bleeding.
– Non-silicone Thermal Conductivity 5.6 W/mK
– Dispensable and Compliant
– Easily reworkable Meets RoHS and REACH requirements
– Very low fogging Elevated temperature resistance
| Colour | grey |
| Shelf Life | 6 months |
| Minimum Bondline Thickness | 0.15 microns (0.15 mm) |
| Density | 3.40 g/cc |
| Maximum Operating Temperature | 150°C |
| Minimum Operating Temperature | -40°C |
| UL Flamming Rating | V0 |
| Outgassing TML | 0.30% |
| Outgassing CVCM | 0.10% |
| ROHS Compliant | Yes |
| REACH | Yes |
The Tputty™ SF560 are available in a range of variants designed to meet specific application needs. These versions differ in format, construction, or additional features, providing flexibility in design and optimal compatibility with various systems and assembly processes.
Interested in learning more about how the Tputty™ SF560 can support your project or application? Whether you need technical details, pricing information, or would like to request a sample, our team is here to help. Fill out the form below and we’ll get back to you with the support and solutions you need. Discover how the Tputty™ SF560 can bring added value to your design and performance requirements.
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