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Gap filler – EU-TF110
EU-TF110 is a very soft, free standing gap filler designed to combine good thermal conductivity of 1,1 W/mK with high compliancy. The special ceramic filler allows EU-TF110 to remain a cost effective solution where moderate thermal performance is acceptable.
EU-TF110 is naturally tacky and does not require an additional adhesive coating that can inhibit thermal performance.
EU-TF110 is electrically insulating, stable from -40°C to 160°C and meets UL 94V0 rating side.
Features and Benefits
– Thermal conductivity 1,1 W/mK
– Soft and compliant for low stress applications
– Available in 20 thicknesses from 0,25mm to 5,0mm
Configurations
– Die cut parts
– Kiss cut parts on sheet
Examples or main applications
– Telecommunication hardware
– Mass storage drives
– Automotive engine control units
– Memory modules
– Wireless communication HW
– Base station
– Heat pipe thermal sol
Properties
| Colour | Light Grey |
| Construction | Filled silicone elastomer |
| Thickness Range | 0,25mm – 5,0mm |
| Specific Gravity | 1,73 g/cc |
| Hardness | 50 Shore 00 |
| Thermal conductivity | 1,1 W/mK |
| Temperature range | -40 °C to 160 °C |
| UL Flamming Rating | 94 V0 |
| Outgassing TML | 0,34% |
| Outgassing CVCM | 0,10% |
| Volumic resistivity | 10^13 Ohm-cm |
Product variants
The Gap filler – EU-TF110 are available in a range of variants designed to meet specific application needs. These versions differ in format, construction, or additional features, providing flexibility in design and optimal compatibility with various systems and assembly processes.
Capabilities & customisation
Industries
General Catalogue
Request information
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