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Tgon 800

Electrically Condutive Graphite Gap Filler

Used where electrical isolation is not required, Tgon 800 is ideal for where electrical contact and thermal transfer are desired. Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the XY plane and 5 W/mK through the z-axis. Tgon 800 can be supplied in 12” x 18” (305mm x 457mm) or 18” x 24” (457mm x 610mm) sheets, rolls or die-cut to specific configurations. It is also available with proprietary pressure sensitive adhesive on one side. This adhesive coating is the thinnest available, minimizing any impact on thermal performance.

Features and Benefits

The Tgon 800 offer a combination of functional and performance-oriented characteristics that make them a reliable choice for demanding applications.

– Non-silicone Thermal Conductivity 5.6 W/mK
– Dispensable and Compliant
– Easily reworkable Meets RoHS and REACH requirements
– Very low fogging
– Elevated temperature resistance

Examples or main applications

The Tgon 800 are well-suited for integration into a wide range of electronic and industrial systems. Their performance and versatility make them a dependable choice across multiple sectors, supporting both high-volume manufacturing and specialized applications where reliability and efficiency are critical.
– Automotive Lighting
– LED Lighting
– Notebooks/Tablets/Portable Devices
– Power Converters
– Power Supplies

Properties

The Tgon 800 feature a balanced combination of physical, thermal, and electrical properties, making them suitable for a broad range of technical applications. Each characteristic is validated through industry-recognized test methods to ensure consistency, performance, and compliance with quality standards.

ColourPewter
Shelf Life2 years from Date of Shipment with Adhesive: 1 year from date of shipment
Thickness Max0.51 mm (0.20")
Thickness Min0.13 mm (0.05")
Density2.20 g/cc
Hardness85 Shore 00
Thermal conductivity5.00 W/mK
Maximum Operating Temperature300°C
Minimum Operating Temperature-240°C
Thermal Resistance @10 psi Max (C-in²/W)11.32
Thermal Resistance @10 psi Min (C-in2/W)4.10
Thermal Resistance @30 psi Max (C-in2/W)5.40
Thermal Resistance @30 psi Min (C-in2/W)2.55
Thermal Resistance @Thermal Resistance @50 psi Max (C-in2/W)4.30
Thermal Resistance @50 psi Min (C-in2/W)2.35
UL Flamming RatingV-0
Outgassing TML2.30%
Outgassing CVCM1.30%
ROHS CompliantYes

Product variants

The Tgon 800 are available in a range of variants designed to meet specific application needs. These versions differ in format, construction, or additional features, providing flexibility in design and optimal compatibility with various systems and assembly processes.

ImageCodeDetail
A10462-02Tgon 805,A1 12x18in
A10462-03Tgon 805,A0 12x18in
A10462-15Tgon 805,A0 18x24in
A10462-20Tgon 805,A1 18x24in
A10463-01Tgon 810,A0 12x18in
A10463-02Tgon 810,A1 12x18in
A10463-10Tgon 810,A0 18x24in
A10463-12Tgon 810,A1 18x24in,
A10464-01Tgon 820,A0 12x18in
A10464-02Tgon 820,A1 12x18in
A10464-07Tgon 820,A0 18x24in
A10464-10Tgon 820,A1 18x24in
A11927-01Tgon 810; SA; 18x23in

Capabilities & customisation

Automated Pad PlacementAutomated PackagingCustom AutomationCustom Product DevelopmentModelingPrototypingServiceTesting

Industries

AutomotiveAerospace/Defense

General Catalogue

Request information

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Related products

The information and technical data provided on this website are for general informational purposes only. While we strive to ensure that all content is accurate, complete, and up to date, we make no representations or warranties of any kind, express or implied, regarding the reliability, suitability, or availability of the information contained herein.

Any reliance you place on such information is strictly at your own risk. We disclaim any liability for errors, inaccuracies, or omissions and for any loss, injury, or damages resulting from the use of the information provided.

Technical specifications, data, or figures may be subject to change without notice. For official, detailed, or binding information, please contact us directly.