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Tpcm 780 is a high performance, inherently tacky, easy to rework phase change thermal interface material. Developed specifically to meet the high thermal conductivity and low thermal resistance requirements of today’s demanding processors. This silicone-free material is so soft that it begins to flow as the temperature is elevated by just a small amount. Also, since no tabs are required, Tpcm 780 eliminates the need for expensive converting.
– Silicone-free for applications that are silicone sensitive
– Outstanding thermal performance helps to ensure CPU/application reliability
– No mess due to thixotropic characteristics which prevent flow outside of interface
| Thermal conductivity | 5.40 W/mK |
The Tpcm™ 780 are available in a range of variants designed to meet specific application needs. These versions differ in format, construction, or additional features, providing flexibility in design and optimal compatibility with various systems and assembly processes.
Interested in learning more about how the Tpcm™ 780 can support your project or application? Whether you need technical details, pricing information, or would like to request a sample, our team is here to help. Fill out the form below and we’ll get back to you with the support and solutions you need. Discover how the Tpcm™ 780 can bring added value to your design and performance requirements.
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Any reliance you place on such information is strictly at your own risk. We disclaim any liability for errors, inaccuracies, or omissions and for any loss, injury, or damages resulting from the use of the information provided.
Technical specifications, data, or figures may be subject to change without notice. For official, detailed, or binding information, please contact us directly.
