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Tpcm™ 780SP
Screen Printable Phase Change Material
Tpcm 780SP is a high performance, inherently tacky, easy to rework screen printable phase change thermal interface material. Developed specifically to meet the high thermal conductivity and low thermal resistance requirements of today’ss demanding processors. This silicone-free material is so soft that it begins to flow as the temperature is elevated by just a small amount.
Features and Benefits
– Silicone-free for applications that are silicone sensitive
– Low total thermal resistance
– Inherently tacky and easy to use, no adhesive required
– High thermal reliability
– Ease of use for high volume manufacturing
– No mess due to thixotropic characteristics which prevent flow outside of interface
Examples or main applications
– Hard Disk Drives
– IGBTs
– Memory Modules
– Notebooks/Tablets/Portable Devices
– Servers
– Smart Home Devices
– Wireless infrastructure
Properties
| Colour | Grey |
| Shelf Life | 1 year from Date of Shipment |
| Minimum Bondline Thickness | 0.03 microns (0.03 mm) |
| Density | 2.50 g/cc |
| Thermal conductivity | 5.40 W/mK |
| Maximum Operating Temperature | 125°C |
| Minimum Operating Temperature | -40°C |
| UL Flamming Rating | V-0 |
| Outgassing TML | 8.30% |
| Outgassing CVCM | 3.20% |
| ROHS Compliant | Yes |
Product variants
The Tpcm™ 780SP are available in a range of variants designed to meet specific application needs. These versions differ in format, construction, or additional features, providing flexibility in design and optimal compatibility with various systems and assembly processes.
| Image | Code | Detail |
|---|---|---|
 | A16001-00 | Tpcm 780SP 1kg,Can,1quart |
| A16001-01 | Tpcm 780SP 1/2kg,Can,1pint |
| A16001-02 | Tpcm 780SP 20kg,5Gal Pail, |
Capabilities & customisation
Industries
General Catalogue
Request information
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