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News / Manifestations

Wire Mesh over Elastomer
Euro Technologies offers a range of Wire Mesh over Elastomer with low compression requirements and low compression set. This Wire Mesh over Elastomer is available in a

Ferrite
Euro Technologies distributes Ferrite for signal line and EMI filtering applications. Our range of Ferrite includes toroids for flat cables, Ferrite for Surface Mount Devices (SMD) and

Absorbeurs de micro-ondes
The interest in Microwave Absorber technology has been steadily growing both in military and commercial electronics. Microwave Absorbers by Euro Technologies are coatings with altered electrical and/or

Conductive Fabric
Euro Technologies offers a wide range of polyester woven, non-woven and mesh shielding Conductive Fabric with copper and nickel. Conductive Fabric has been developed from lightweight fabrics

Conductive Foam
Euro Technologies has developed a new line of Conductive Foam as an innovative alternative to traditional EMI/RFI shielding products. Conductive Foam provides conductivity along the XYZ axis.

Electrically Conductive Paints
Electrically Conductive Paints are a highly versatile product within the EMI/RFI shielding product range. Electrically Conductive Paints represent an optimal solution to various needs. In order to

Combi Gasket
In Combi Gaskets, the elastomer is made of neoprene or silicone. Combi Gaskets are specifically designed to combine outstanding attenuation characteristics with environmental sealing for enclosures housing

Honeycomb Vent Panels Filters
Honeycomb Panels reduce electromagnetic interference. Euro Technologies offers EMI shielding Honeycomb Vent Panels Filters. A wide range of materials is available as well as platings and mounting

Flat Gasket
Flat Gasket is part of conductive elastomers. Highly conductive and with environmental sealing properties, Flat Gasket is a compound of metal mesh impregnated with an elastomer. The

Double-side Thermal Conductive Tape
The Double-side Thermal Conductive Tape is a thermally conductive adhesive tape designed to provide an efficient method of mounting heat sinks onto devices such as microprocessors, small