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CoolShield-Flex is a stack-up film of thermal interface materials (TIM), metal foils and conductive pressure sensitive adhesives (CPSA). Used together with board level shielding (BLS) frame, it can perform both thermal transmission and shielding for ICs in electronics devices. Meanwhile, CoolShield-Flex provides lower total thickness comparing with other solutions, which makes it fit for use in all compact space designs such as smartphones, tablets and other consumer electronics.
– Low height
– Low weight
– Disposable
– Ease of maintenance
– RoHS compliance and Halogen free
The CoolShield-Flex Series are available in a range of variants designed to meet specific application needs. These versions differ in format, construction, or additional features, providing flexibility in design and optimal compatibility with various systems and assembly processes.
| Image | Code | Detail |
|---|---|---|
 | TFLEX HR600 | Construction: Filled silicone elastomer Color: Dark Grey Thermal Conductivity ASTM D5470: 3W/mK Hardness (Shore 00) ASTM D2240 (3 second): 40 Density: 2.5 g/cc Operating temperature range: -45°C up to 200°C Volume resistivity ASTM D257: 1013 Ohm-cm UL Flammability Rating: 94V0 |
| TCPM585 | Construction: Non-reinforced film Color: Grey Specific gravity: 2.87 g/cc Thermal Conductivity: 3.8 W/mK Phase change softening temperature: 50° C Operating temperature range: -40°C up to 125°C Volume resistivity: 3.0 x 10^12 Ohm-cm |
| Copper Foil with CPSA | Adhesive strength with 180o Peel: ≥1.3kg/inch Operating temperature range (°C): -20°C up to 120°C |
Interested in learning more about how the CoolShield-Flex Series can support your project or application? Whether you need technical details, pricing information, or would like to request a sample, our team is here to help. Fill out the form below and we’ll get back to you with the support and solutions you need. Discover how the CoolShield-Flex Series can bring added value to your design and performance requirements.
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