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It weighs only about half that of polystyrene and one quarter that of polytetrafluoroethylene. FlexK LoK is waterproof and has excellent thermal characteristics, tolerating high and low temperatures. The material does not flake or shed. It is used in a variety of applications, from thin dielectric spacers on printed circuit boards to radomes.
– Low dielectric constant
– Light weight and flexible
– Excellent thermal insulation and stability
| Colour | White |
| Function | Dielectric |
| Resin | Silicone |
| Shelf Life | Minimum 720 Days from Date of Shipment |
| Type | Low loss dielectric elastomer |
| Thickness Max | 0.50 mm |
| Thickness Min | 0.50 mm |
| Density | 0.55 g/cc |
| Tensile strength | 0.9 Mpa |
| Thermal conductivity | 0.11 W/mK |
| Maximum Operating Temperature | 177°C |
| Minimum Operating Temperature | -70°C |
| Outgassing TML | 14.00% |
| Outgassing CVCM | 1.50% |
| Frequency Range | 0.1 – 10 Ghz |
| ROHS Compliant | Yes |
| REACH | Yes |
| Option Availability – PSA | Yes |
| Option Availability – on drawing | Yes |
The Eccostock™ FlexK LoK are available in a range of variants designed to meet specific application needs. These versions differ in format, construction, or additional features, providing flexibility in design and optimal compatibility with various systems and assembly processes.
| Image | Code | Detail |
|---|---|---|
![]() | 28017104 | FLEXK=1.7/PSA 12x12x.020 |
Interested in learning more about how the Eccostock™ FlexK LoK can support your project or application? Whether you need technical details, pricing information, or would like to request a sample, our team is here to help. Fill out the form below and we’ll get back to you with the support and solutions you need. Discover how the Eccostock™ FlexK LoK can bring added value to your design and performance requirements.
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