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Gap filler – EU-TP250

Features and Benefits

The Gap filler – EU-TP250 offer a combination of functional and performance-oriented characteristics that make them a reliable choice for demanding applications.

– Thermal Conductivity: 2,5 W/mK
– High conformability
– Electrically insulating
– Naturally tacky

Gap filler – EU-TP250 - COMPRESSION DEFLECTION

Configurations

The Gap filler – EU-TP250 are designed to offer reliable and versatile solutions for a wide range of applications. Their structure and material properties make them particularly suitable for use in environments that demand consistent performance and high-quality standards. Available in various formats to meet specific needs, the Gap filler – EU-TP250 ensure both efficiency and ease of handling.

– Sheet 200x400mm
– Custom Die-cut parts
– Kiss cut parts on sheet

Examples or main applications

The Gap filler – EU-TP250 are well-suited for integration into a wide range of electronic and industrial systems. Their performance and versatility make them a dependable choice across multiple sectors, supporting both high-volume manufacturing and specialized applications where reliability and efficiency are critical.

– Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink
– Led Lighting, LCD TV, Telecom device, wireless Hub,NB
– PC, power supply etc
– Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink

Properties

The Gap filler – EU-TP250 feature a balanced combination of physical, thermal, and electrical properties, making them suitable for a broad range of technical applications. Each characteristic is validated through industry-recognized test methods to ensure consistency, performance, and compliance with quality standards.

Colour	Light Yellow
Construction	Silicone & Ceramic filled
Thickness Range	0,5mm – 5,0mm
Density	2,93 g/cc
Tensile strength	0,4 kN/m
Elongation	72%
Hardness	25 Shore C
Thermal conductivity	2,5 W/mK
Continuous use Temperature	-40 °C to 150°C
Flammability Rating	V0
Voltage Breakdown	≥ 5,0 kV/mm
Volume Impedance	3.2*10^16 Ohm-cm
Dielectric constant	6,3 @ 1 MHz
ROHS Compliant	Yes
REACH	Yes

Product variants

The Gap filler – EU-TP250 are available in a range of variants designed to meet specific application needs. These versions differ in format, construction, or additional features, providing flexibility in design and optimal compatibility with various systems and assembly processes.

Capabilities & customisation

Industries

Telecom infrastructure and wireless networks

General Catalogue

Certifications

Request information

Interested in learning more about how the Gap filler – EU-TP250 can support your project or application? Whether you need technical details, pricing information, or would like to request a sample, our team is here to help. Fill out the form below and we’ll get back to you with the support and solutions you need. Discover how the Gap filler – EU-TP250 can bring added value to your design and performance requirements.

Related products

The information and technical data provided on this website are for general informational purposes only. While we strive to ensure that all content is accurate, complete, and up to date, we make no representations or warranties of any kind, express or implied, regarding the reliability, suitability, or availability of the information contained herein.

Any reliance you place on such information is strictly at your own risk. We disclaim any liability for errors, inaccuracies, or omissions and for any loss, injury, or damages resulting from the use of the information provided.

Technical specifications, data, or figures may be subject to change without notice. For official, detailed, or binding information, please contact us directly.

EMI-RFI

Thermal management

Laird™

Custom solutions