Euro Technologies adds Tgel™ 600 to its thermal management portfolio. This single-component dispensable thermal interface material (TIM) is engineered for applications demanding high heat dissipation and low contact resistance.
Featuring a thermal conductivity of 6.4 W/mK, Tgel™ 600 consists of ceramic particles within a cross-linked silicone matrix. This hybrid structure allows the material to thoroughly wet thermal surfaces, minimizing Bondline Thickness and delivering superior performance compared to traditional thermal pads.
Pump-Out Resistance and Long-Term Reliability
The distinct technical advantage of Tgel™ 600 is its excellent rheological stability. Unlike standard thermal greases, its cross-linked formulation prevents pump-out (material displacement due to thermal expansion and contraction cycles) and inhibits oil separation (dry-out).
The material is thixotropic: it flows easily under the pressure of automated dispensing systems but instantly recovers viscosity upon application, remaining stable even in vertical orientations. Soft and compliant, it exerts minimal stress on delicate electronic components.
It is ideal for use on microprocessors, ASICs, and power modules in automotive and telecommunications sectors.
To view the full specifications and ageing test data, visit the Tgel™ 600 product page on the Euro Technologies website.
