Euro Technologies adds Tputty™ 607MF to its thermal management portfolio. This single-part, ceramic-filled silicone liquid gap filler is engineered to optimize thermal transfer in high-speed assembly processes.
This Thermal Interface Material (TIM) is designed to fill complex and variable gaps between heat-generating components and heat sinks, maintaining low thermal resistance even under moderate pressure.
Controlled Flow for Industrial Automation
The defining feature of Tputty™ 607MF is its superior rheology, delivering a flow rate of 105 g/min. This high flow capability facilitates automated dispensing via standard equipment, reducing production cycle times without compromising performance.
With a thermal conductivity of 6.2 W/mK, Tputty™ 607MF provides:
- Vertical Stability: Remains in place after dispensing (thixotropic), making it ideal for non-horizontal applications.
- Low Component Stress: Its soft and compliant nature minimizes mechanical load on delicate chips and boards during mating.
- Reworkability: As a non-curing material, it simplifies potential rework or maintenance operations.
The product is RoHS and REACH compliant and is suitable for applications in automotive electronics, telecom base stations, and high-power microprocessors.
For detailed technical specifications and deflection charts, visit the Tputty™ 607MF’s product page.
