With the development of increasingly powerful electronic devices and components, there is a dramatic increase of heat generation within the enclosure, while the market demands more compact enclosure dimensions. Notebooks for example are being developed with continuously higher pulsed processors, while notebook cabinets keep getting flatter and smaller.
Heat, generated by the processor, additionally accumulates within the extreme tightly measured enclosure interior and therefore impacts performance and efficiency considerably.
Therefore, Euro Technologies in addition to its famous solutions for electromagnetic compatibility, has nowadays one of the most complete and suitable product range dedicated to the thermal management.
In order to reduce the operating temperature of an electronic component, thermal resistance of the heat sink should be as low as possible, thus there is a need for thermally high conductive materials, which also reduce the thermal resistance.
Depending on the requirements or respectively the application, Euro Technologies can support his customers supplying heat conductive greases or pastes, Gap Filler pads, isolators and phase-change materials.
Every customer’s application can count on Euro Technologies technical and commercial suggestions in order to better identify the most effective interface.
Thermisches Management continues to play a more important role for example in the following application areas :
- Telecommunications
- IT technology and control engineering
- Automotive
- Medical engineering
- Safety engineering
- Automatisierung
- Enclosure construction
