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Tlam PP 1KA

Thermally Conductive Pre-preg

Tlam™ is a thermally conductive IMPCB substrate used for heat dissipation in electronics circuit boards used in Power Supplies, DC-DC Converters, LEDs & Ballast Lighting, Automotive, Appliances, Commercial & Industrial Motor Drives, and Military & Aerospace Applications. The heart of this system is the thermally conductive pre-preg, Tlam PP KA.  This ceramically filled 3 W/mK, dielectric prepreg offers 8-10 times better thermal performance over FR4, while maintaining good adhesion and voltage breakdown properties. Tlam PP 1KA is a “B” State epoxy film providing room temperature stability for 6 months. Tlam PP 1KA is provided in multiple thicknesses.  Thinner films offer better thermal performance while thicker films offer better dielectric strength.  Tlam PP 1KA can be used to build many different combinations of PCB laminates.   The simplest is copper foil, Tlam PP 1KA dielectric and an aluminum base plate which acts as a heatsink and adds rigidity. Board complexity goes up from here offering multi-layer boards constructions and PCB structures can further include varying layers of Tlam PP 1KA and FR4 layers to give the thermal properties where need while maintaining cost effectiveness.  Tlam PP 1KA can laminated with copper foils from ½ oz to 4 oz can be used aluminum or copper base plates ranging from 2.5mm to 6mm thick.  Further Tlam PP 1KA and be laminated on both sides with copper films to make traditional type PCB Cores.

Features and Benefits

The Tlam PP 1KA offer a combination of functional and performance-oriented characteristics that make them a reliable choice for demanding applications.

– Low Thermal Resistance for SMD & Chip & Wire Components
– Compatible with Heavy Copper Foil & most Pre-pregs
– Low Modulus for Stress Relief & High Reliability
– High Tg for Excellent HV & Hi-Temperature Operation (1HTD)
– Mechanically Rugged under Vibration and Mechanical Shock
– Integral aluminum Base Plate for Mechanical & Thermal Interface
– Compatible with Power Substrate & Multilayer Construction
– Uses Standard low-cost PCB Fabrication Techniques
– Can run through standard pick and place SMT and manual wire bond processes.

Examples or main applications

The Tlam PP 1KA are well-suited for integration into a wide range of electronic and industrial systems. Their performance and versatility make them a dependable choice across multiple sectors, supporting both high-volume manufacturing and specialized applications where reliability and efficiency are critical.

Properties

The Tlam PP 1KA feature a balanced combination of physical, thermal, and electrical properties, making them suitable for a broad range of technical applications. Each characteristic is validated through industry-recognized test methods to ensure consistency, performance, and compliance with quality standards.

ROHS CompliantYes

Product variants

The Tlam PP 1KA are available in a range of variants designed to meet specific application needs. These versions differ in format, construction, or additional features, providing flexibility in design and optimal compatibility with various systems and assembly processes.

Capabilities & customisation

Automated Pad PlacementAutomated PackagingCustom AutomationCustom Product DevelopmentModelingPrototypingServiceTesting

Industries

General Catalogue

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